The role of Channelium in improving SMD component performance

The role of Channelium in improving SMD component performance

SMD components—the backbone of IoT and consumer electronics—face escalating thermal and mechanical challenges. By creating optimized heat-transfer pathways, Channelium lowers operating temperature and spreads heat more uniformly across the PCB, reducing thermal stress, preventing cold solder joints, and improving cyclic thermal test yields.

Beyond thermal management, Channelium’s honeycomb-like structure distributes vibration energy evenly. In industrial or transport environments this mitigates micro-cracking in solder joints and increases shock resistance and overall mechanical reliability.

Finally, Channelium supports high-density assembly: its flat, stable surface promotes uniform solder paste deposition and more accurate component placement. The video below shows automated soldering on a Channelium-enhanced board, highlighting higher throughput and fewer rejects.